Qualification:
B.Tech / M.Tech or equivalent from a reputed University
Experience:
5+ years of relevant experience
Job Description:
- Be a member of the team that plays a significant role in ensuring the quality of next generation processors for Smart phones and Smart card through structured DFT, Automatic Test Pattern Generation (ATPG) and Memory Built-In Self-Test (MBIST) techniques. Primary responsibilities will include Interfacing with the design teams to ensure DFT design rules and guidelines are met.
- Generating high quality manufacturing ATPG test patterns for (SAF) stuck-at, transition fault (TDF), Path Delay fault (PDF) models and through the use of on-chip test compression techniques. MBIST verification and test pattern generation through Mentor tool.
- Work closely with design team on IDDQ constrains validation and pattern generation along with IVA analysis.
- Simulating and verifying the ATPG (SAF, TDF) and MBIST patterns on unit delay and min/max timing corners.
- Working with the Product/Test engineering teams on the delivery of manufacturing test patterns for ATE debug.
- Lead team of 2-3 engineers working bin DFT/ADFT pattern generation and validation
- Contribute to technical innovation, development of innovative techniques in the area of test cost reduction, simulation time reduction and quality enhancement
- Responsible for supporting post Si debug effort, issue resolution
- Developing, enhancing and maintaining scripts as necessary.